发明申请
- 专利标题： Substrate processing method, substrate processing apparatus, and manufacturing method of semiconductor device
- 专利标题（中）： 基板处理方法，基板处理装置以及半导体装置的制造方法
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申请号： US11654565申请日： 2007-01-18
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公开(公告)号： US20070190462A1公开(公告)日： 2007-08-16
- 发明人: Eishi Shiobara , Kentaro Matsunaga , Daisuke Kawamura , Tomoyuki Takeishi , Kei Hayasaki , Shinichi Ito
- 申请人： Eishi Shiobara , Kentaro Matsunaga , Daisuke Kawamura , Tomoyuki Takeishi , Kei Hayasaki , Shinichi Ito
- 优先权： JP2006-013061 20060120
- 主分类号： G03F7/20
- IPC分类号： G03F7/20
摘要：
A substrate processing method including while a liquid is supplied between a processing target substrate to be applied with exposure treatment and a projection optical system of an exposure apparatus for carrying out the exposure treatment, prior to providing a resist film on a first main face of the processing target substrate that is provided for liquid immersion exposure for carrying out the exposure treatment at a side to be applied with the exposure treatment, selectively applying at least hydrophobic treatment with respect to a region in a predetermined range from a peripheral rim part of a second main face opposite to the first main face.