Invention Application
US20070190725A1 Methods of Manufacturing Semiconductor devices Having Buried Bit Lines
审中-公开
制造埋置位线的半导体器件的方法
- Patent Title: Methods of Manufacturing Semiconductor devices Having Buried Bit Lines
- Patent Title (中): 制造埋置位线的半导体器件的方法
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Application No.: US11740525Application Date: 2007-04-26
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Publication No.: US20070190725A1Publication Date: 2007-08-16
- Inventor: Tae-yong Kim , Choong-ho Lee , Chul Lee , Eun-suk Cho , Suk-kang Sung , Hye-jin Cho
- Applicant: Tae-yong Kim , Choong-ho Lee , Chul Lee , Eun-suk Cho , Suk-kang Sung , Hye-jin Cho
- Priority: KR10-2004-0107993 20041217
- Main IPC: H01L21/336
- IPC: H01L21/336

Abstract:
A semiconductor device includes a semiconductor substrate having a first conductivity type and having an upper portion, a pair of bit lines extending in a first direction and doped with an impurity of a second conductivity type opposite to the first conductivity type and spaced from one another in the upper portion of the semiconductor substrate, a first line formed between the pair of bit lines having a plurality of alternating recessed device isolation regions and channel regions, with each of the channel regions contacting each bit line of the at least one pair of bit lines, and word lines formed at right angles to the first lines and covering the channel regions.
Information query
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