发明申请
- 专利标题: PLASMA DOPING METHOD
- 专利标题(中): 等离子喷涂方法
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申请号: US11741861申请日: 2007-04-30
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公开(公告)号: US20070190759A1公开(公告)日: 2007-08-16
- 发明人: Yuichiro Sasaki , Katsumi Okashita , Hiroyuki Ito , Bunji Mizuno , Tomohiro Okumura
- 申请人: Yuichiro Sasaki , Katsumi Okashita , Hiroyuki Ito , Bunji Mizuno , Tomohiro Okumura
- 申请人地址: JP Osaka
- 专利权人: Matsushita Electric Industrial Co., Ltd.
- 当前专利权人: Matsushita Electric Industrial Co., Ltd.
- 当前专利权人地址: JP Osaka
- 优先权: JP2004-360122 20041213; JP2005-128301 20050426
- 主分类号: H01L21/26
- IPC分类号: H01L21/26 ; H01L21/42
摘要:
A plasma doping method that can control a dose precisely is realized. In-plane uniformity of the dose is improved. It has been found that, if a bias is applied by irradiating B2H6/He plasma onto a silicon substrate, there is a time at which a dose of boron is made substantially uniform, and the saturation time is comparatively long and ease to stably use, compared with a time at which repeatability of an apparatus control can be secured. The invention has been finalized focusing on the result. That is, if plasma irradiation starts, a dose is initially increased, but a time at which the dose is made substantially uniform without depending on a time variation is continued. In addition, if the time is further increased, the dose is decreased. The dose can be accurately controlled through a process window of the time at which the dose is made substantially uniform without depending on the time variation.
公开/授权文献
- US07348264B2 Plasma doping method 公开/授权日:2008-03-25
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