发明申请
- 专利标题: Thermostatic expansion valve
- 专利标题(中): 恒温膨胀阀
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申请号: US11357632申请日: 2006-02-17
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公开(公告)号: US20070194140A1公开(公告)日: 2007-08-23
- 发明人: David Nestler , Mike Noble
- 申请人: David Nestler , Mike Noble
- 专利权人: Emerson Electric Co.
- 当前专利权人: Emerson Electric Co.
- 主分类号: F25B41/06
- IPC分类号: F25B41/06
摘要:
A thermostatic expansion valve is provided comprising an inlet, an outlet, first and second flow paths through the valve, a first valve element in the first flow path between the inlet and outlet, and a movable diaphragm having a first side acted on by a first fluid pressure and a second side acted on by at least a second fluid pressure. The diaphragm moves in response to changes in the pressures against the first and second sides of the diaphragm, wherein the diaphragm movement allows first valve element to move to regulate fluid flow through the first flow path. The diaphragm is movable to permit increased flow through the first flow path when the force against the first side is greater than that against the second side, and is movable to restrict flow through the first flow path when the force against the first side is less than that against the second side. The diaphragm moves in an upward direction to cause the first valve element to close the first flow path, and may continue to move in the upward direction to cause a second flow path to open when the diaphragm is displaced more than a predetermined distance beyond the closure of the first flow path.
公开/授权文献
- US07707844B2 Thermostatic expansion valve with bypass passage 公开/授权日:2010-05-04
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