发明申请
- 专利标题: Packaging structure and method of an image sensor module
- 专利标题(中): 图像传感器模块的包装结构和方法
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申请号: US11790313申请日: 2007-04-25
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公开(公告)号: US20070195188A1公开(公告)日: 2007-08-23
- 发明人: Fang-Jun Leu , Shou-Lung Chen , Ching-Wen Hsiao , Shan-Pu Yu , Jyh-Rong Lin , I-Hsuan Peng , Jian-Shu Wu , Hui-Mei Wu , Chien-Wei Chieh
- 申请人: Fang-Jun Leu , Shou-Lung Chen , Ching-Wen Hsiao , Shan-Pu Yu , Jyh-Rong Lin , I-Hsuan Peng , Jian-Shu Wu , Hui-Mei Wu , Chien-Wei Chieh
- 申请人地址: TW Chutung
- 专利权人: Industrial Technology Research Institute
- 当前专利权人: Industrial Technology Research Institute
- 当前专利权人地址: TW Chutung
- 优先权: TW093123218 20040803
- 主分类号: H04N5/225
- IPC分类号: H04N5/225
摘要:
This invention relates to a packaging structure and method of an image sensor module. The method comprises: providing a transparent substrate having a first patterned conductive layer; carrying an image sensor integrated circuit chip having a photosensitive active area and at least one passive chip on the transparent substrate, wherein the photosensitive active area faces the transparent substrate; forming an insulating build-up film over the transparent substrate; and forming a plurality of conductive vias in the insulating build-up film wherein the ends of the conductive vias are connected with the passive chip or the first patterned conductive layer of the transparent substrate while the other ends of the conductive vias are exposed on the surface of the insulating build-up film. The packaging method is capable of down-sizing the construction of the image sensor module and simplifying the processing steps.
公开/授权文献
- US07572676B2 Packaging structure and method of an image sensor module 公开/授权日:2009-08-11