发明申请
- 专利标题: Method for using partitioned masks to build a chip
- 专利标题(中): 使用分区掩码构建芯片的方法
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申请号: US11359229申请日: 2006-02-22
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公开(公告)号: US20070196958A1公开(公告)日: 2007-08-23
- 发明人: Subhrajit Bhattacharya , John Darringer , Daniel Ostapko
- 申请人: Subhrajit Bhattacharya , John Darringer , Daniel Ostapko
- 申请人地址: US NY Armonk
- 专利权人: International Business Machines Corporation
- 当前专利权人: International Business Machines Corporation
- 当前专利权人地址: US NY Armonk
- 主分类号: H01L21/82
- IPC分类号: H01L21/82 ; H01L21/331
摘要:
A mask reuse methodology process in which the soft logic is implemented with a generic array type cell structure mask and a custom blocking mask. A method is provided comprising printing a set of component cores onto a die at predetermined locations with a reusable mask set; providing a custom blocking mask that includes opaque regions that positionally correspond with the component cores on the die; superimposing the custom blocking mask with a generic array type cell mask to form superimposed masks; and using the superimposed masks to print generic array type cells onto the die with the exception of the predetermined locations where the set of component cores reside.
公开/授权文献
- US07469401B2 Method for using partitioned masks to build a chip 公开/授权日:2008-12-23
信息查询
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