发明申请
US20070199385A1 Capacitor electrode formed on surface of integrated circuit chip
审中-公开
集成电路芯片表面形成电容电极
- 专利标题: Capacitor electrode formed on surface of integrated circuit chip
- 专利标题(中): 集成电路芯片表面形成电容电极
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申请号: US11601597申请日: 2006-11-17
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公开(公告)号: US20070199385A1公开(公告)日: 2007-08-30
- 发明人: David O'Brien , Liang You
- 申请人: David O'Brien , Liang You
- 申请人地址: US GA Atlanta 30308
- 专利权人: CardioMEMS, Inc.
- 当前专利权人: CardioMEMS, Inc.
- 当前专利权人地址: US GA Atlanta 30308
- 主分类号: G01L9/12
- IPC分类号: G01L9/12
摘要:
A sensor has a sensor housing defining a cavity therein. A first wall partially defining the cavity is deflectable under a physiologically relevant range of pressures. An integrated circuit chip bearing electronics is fixedly mounted within the cavity. A capacitor comprises first and second capacitor plates in generally parallel, spaced-apart relation. The first capacitor plate is physically coupled to the deflectable wall so as to move as the wall deflects, and the second capacitor plate is carried by the chip. The second capacitor plate is in electrical communication with the input pad of the chip.
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