发明申请
- 专利标题: Electronic component with high density, low cost attachment
- 专利标题(中): 电子元件密度高,附件成本低
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申请号: US11604289申请日: 2006-11-27
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公开(公告)号: US20070207635A1公开(公告)日: 2007-09-06
- 发明人: Mark Gailus , Leon Khilchenko
- 申请人: Mark Gailus , Leon Khilchenko
- 主分类号: H01R12/00
- IPC分类号: H01R12/00
摘要:
A contact tail for an electronic component compatible with surface mount manufacturing techniques. The contact tail is stamped, providing a relatively low manufacturing cost and high precision. High precision in the contact tails in turn provides more reliable solder joints across an array of contact tails in an electronic component. Further, the contact tail may be shaped to reduce the propensity for solder to wick from the attachment area during a reflow operation. Reducing the propensity of solder to wick reduces the chance that solder will interfere with the operation of the electronic component. Additionally, reducing the propensity for solder to wick allows pads to which the contact tail is attached to be positioned over vias, thereby increasing the density with which contacts may be attached to a substrate. The reliability with which electronic assemblies incorporating components using the contact tail is also increased when the contact tail is used in self-centering arrays.
公开/授权文献
- US07484971B2 Electronic component with high density, low cost attachment 公开/授权日:2009-02-03