发明申请
- 专利标题: ELECTRONIC PACKAGE FOR ELECTRICAL MACHINE
- 专利标题(中): 电机电子包装
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申请号: US11749330申请日: 2007-05-16
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公开(公告)号: US20070210662A1公开(公告)日: 2007-09-13
- 发明人: Michael Bradfield
- 申请人: Michael Bradfield
- 申请人地址: US IN Anderson
- 专利权人: REMY INTERNATIONAL, INC.
- 当前专利权人: REMY INTERNATIONAL, INC.
- 当前专利权人地址: US IN Anderson
- 主分类号: H02K9/00
- IPC分类号: H02K9/00 ; H02K11/04 ; H02K5/16
摘要:
Disclosed herein is an electronic package for an electrical machine including a slip ring end frame; a plurality of negative diodes dispersed in an angular fashion in the SRE frame acting as a negative heat sink; a plurality of positive diodes mounted on a separate electrically conductive plate located above a location of the plurality of negative diodes; a non-conductive separator fitted over a series of bosses, configured to electrically insulate; a terminal assembly configured to make appropriate electrical connections between the positive and negative diodes, stator phase leads, and a regulator, which is operably fastened to the SRE frame at a plurality of locations, the regulator electrically connects to the positive heat sink, a stator phase terminal extending from the terminal assembly, SRE frame, and a brush holder; wherein the regulator is perpendicular to the SRE frame.
公开/授权文献
- US07417344B2 Electronic package for electrical machine 公开/授权日:2008-08-26
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