Invention Application
- Patent Title: Thin multichip flex-module
- Patent Title (中): 薄多芯片柔性模块
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Application No.: US11715142Application Date: 2007-03-07
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Publication No.: US20070211711A1Publication Date: 2007-09-13
- Inventor: James E. Clayton
- Applicant: James E. Clayton
- Main IPC: H04L12/50
- IPC: H04L12/50
Abstract:
A thin multichip module comprises: a frame comprising a recessed cavity; a flexible circuit having a plurality of integrated circuit chips disposed thereon, the flexible circuit bonded to the frame over at least a portion of the cavity; and the chips enclosed within the cavity by the flexible circuit; and, electrodes on the module configured to be accessible to an external socket after the frame is inserted in the module.
Information query
