发明申请
US20070212478A1 Wiring member, resin-coated metal part and resin-sealed semiconductor device, and manufacturing method for the resin-coated metal part and the resin-sealed semiconductor device
有权
接线构件，树脂被覆金属部件和树脂密封半导体器件以及树脂被覆金属部件和树脂密封半导体器件的制造方法
- 专利标题： Wiring member, resin-coated metal part and resin-sealed semiconductor device, and manufacturing method for the resin-coated metal part and the resin-sealed semiconductor device
- 专利标题（中）： 接线构件，树脂被覆金属部件和树脂密封半导体器件以及树脂被覆金属部件和树脂密封半导体器件的制造方法
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申请号： US11713099申请日： 2007-03-02
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公开(公告)号： US20070212478A1公开(公告)日： 2007-09-13
- 发明人: Takahiro Fukunaga , Ryoutarou Imura
- 申请人： Takahiro Fukunaga , Ryoutarou Imura
- 优先权： JP2006-058457 20060303; JP2006-208763 20060731
- 主分类号： H05K3/00
- IPC分类号： H05K3/00
摘要：
There is provided a semiconductor device that suppresses the occurrence of resin burrs and has favorable electrical connectivity and bond strength, and a manufacturing method for such semiconductor device. A resin-coated metal part is manufactured by forming an organic coating by depositing a material including functional organic molecules on a wiring lead composed of a metallic material. Each of the functional organic molecules includes a main chain, a first functional group having a metal bonding property, and a second functional group. The first functional group and the second functional group are provided at different ends of the main chain. Thereafter the functional organic molecules self-assemble by bonding of the first functional groups to metal atoms of the wiring lead. After performing the organic coating formation step, resin is adhered to a predetermined surface area of the wiring lead having the organic coating formed thereon.
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