发明申请
US20070216023A1 CONDUCTIVE RESIN COMPOSITION, CONNECTION METHOD BETWEEN ELECTRODES USING THE SAME, AND ELECTRIC CONNECTION METHOD BETWEEN ELECTRONIC COMPONENT AND CIRCUIT SUBSTRATE USING THE SAME
有权
导电树脂组合物，使用该电极的电极之间的连接方法以及使用该电极的电子元件和电路基板之间的电连接方法
- 专利标题： CONDUCTIVE RESIN COMPOSITION, CONNECTION METHOD BETWEEN ELECTRODES USING THE SAME, AND ELECTRIC CONNECTION METHOD BETWEEN ELECTRONIC COMPONENT AND CIRCUIT SUBSTRATE USING THE SAME
- 专利标题（中）： 导电树脂组合物，使用该电极的电极之间的连接方法以及使用该电极的电子元件和电路基板之间的电连接方法
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申请号： US11683612申请日： 2007-03-08
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公开(公告)号： US20070216023A1公开(公告)日： 2007-09-20
- 发明人: Seiichi Nakatani , Seiji Karashima , Takashi Kitae , Susumu Sawada
- 申请人： Seiichi Nakatani , Seiji Karashima , Takashi Kitae , Susumu Sawada
- 申请人地址： JP Osaka
- 专利权人： Matsushita Electric Industrial Co., Ltd.
- 当前专利权人： Matsushita Electric Industrial Co., Ltd.
- 当前专利权人地址： JP Osaka
- 优先权： JP2006-074962 20060317
- 主分类号： H01L23/34
- IPC分类号： H01L23/34
摘要：
The present invention provides a conductive resin composition for connecting electrodes electrically, in which metal particles are dispersed in a flowing medium, wherein the flowing medium includes a first flowing medium that has relatively high wettability with the metal particles and a second flowing medium that has relatively low wettability with the metal particles, and the first flowing medium and the second flowing medium are dispersed in a state of being incompatible with each other. Thereby, a flip chip packaging method that can be applied to flip chip packaging of LSI and has high productivity and high reliability is provided.
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