Device having a contacting structure

Invention Application

US20070216025A1 Device having a contacting structure 有权

Title translation: 具有接触结构的装置

Please log in to see more content

Patent Title: Device having a contacting structure
Patent Title (中): 具有接触结构的装置
Application No.: US11728900

Application Date: 2007-03-27
Publication No.: US20070216025A1

Publication Date: 2007-09-20
Inventor: Norbert Seliger , Karl Weidner , Jorg Zapf
Applicant: Norbert Seliger , Karl Weidner , Jorg Zapf
Assignee: SIEMENS AKTIENGESELLSCHAFT
Current Assignee: SIEMENS AKTIENGESELLSCHAFT
Priority: DE10308978.0 20030228; EPPCT/EP04/00629 20040126
Main IPC: H01L23/485
IPC: H01L23/485

Abstract:

A layer of electrically insulating material is applied to a substrate and a component located thereon, in such a way that said layer follows the surface contours.

Abstract(Chinese):

将一层电绝缘材料施加到基板和位于其上的部件，使得所述层遵循表面轮廓。

Public/Granted literature

US07855451B2 Device having a contacting structure Public/Granted day:2010-12-21

Information query

Global Dossier Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L23/00	半导体或其他固态器件的零部件（H01L25/00优先）
H01L23/48	.用于向或自处于工作中的固态物体通电的装置，例如引线或接线端装置
H01L23/482	..由不可拆卸地施加到半导体本体上的内引线组成的
H01L23/485	...包括导电层和绝缘层组成的层状结构，例如平面型触头