Invention Application
- Patent Title: Semiconductor component having test pads and method and apparatus for testing same
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Application No.: US11804496Application Date: 2007-05-17
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Publication No.: US20070218573A1Publication Date: 2007-09-20
- Inventor: Mohsen Mardi , Jae Cho , Xin Wu , Chih-Chung Wu , Shih-Liang Liang , Sanjiv Stokes , Hassan Bazargan
- Applicant: Mohsen Mardi , Jae Cho , Xin Wu , Chih-Chung Wu , Shih-Liang Liang , Sanjiv Stokes , Hassan Bazargan
- Applicant Address: US CA San Jose
- Assignee: Xilinx, Inc.
- Current Assignee: Xilinx, Inc.
- Current Assignee Address: US CA San Jose
- Main IPC: H01L21/66
- IPC: H01L21/66
Abstract:
A semiconductor component having test pads and a method and apparatus for testing the same is described. In an example, an un-bumped substrate is obtained having a pattern of bond pads configured to support bumped contacts and a plurality of test pads. Each of the plurality of test pads is in electrical communication with a respective one of the bond pads. The substrate is tested using the plurality of test pads. In another example, a substrate is fabricated having a pattern of bond pads configured to support bumped contacts and a plurality of test pads. Each of the plurality of test pads is in electrical communication with a respective one of the bond pads. The substrate is tested using the plurality of test pads. An insulating layer is formed over the plurality of test pads.
Information query
IPC分类:
