发明申请
- 专利标题: Semiconductor manufacturing equipment and heater
- 专利标题(中): 半导体制造设备和加热器
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申请号: US11723028申请日: 2007-03-16
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公开(公告)号: US20070221657A1公开(公告)日: 2007-09-27
- 发明人: Hideki Arai , Satoshi Inada , Yoshikazu Moriyama , Noriki Juumatsu
- 申请人: Hideki Arai , Satoshi Inada , Yoshikazu Moriyama , Noriki Juumatsu
- 专利权人: NuFlare Technology, Inc.
- 当前专利权人: NuFlare Technology, Inc.
- 优先权: JPP2006-083517 20060324
- 主分类号: H05B1/02
- IPC分类号: H05B1/02
摘要:
Semiconductor manufacturing equipment includes a heater element configured to heat a wafer, a first connection part and a second connection part which are integrated with the heater element, configured to apply voltages to the heater element, a first electrode contacted with and fixed to the first connection part on a first surface of the first electrode configured to be to apply a voltage to the first connection part, a second electrode which is contacted with and fixed to the second connection part on a second surface of the second electrode, configured to apply a voltage to the second connection part, and the second surface is perpendicular to the direction of the first surface.