Invention Application
- Patent Title: Liquid coating apparatus and method thereof
- Patent Title (中): 液体涂布装置及其方法
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Application No.: US11525026Application Date: 2006-09-22
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Publication No.: US20070224347A1Publication Date: 2007-09-27
- Inventor: Jin Sung Lee , Tae Gyu Kim , June Mo Koo , Chang Hoon Jung
- Applicant: Jin Sung Lee , Tae Gyu Kim , June Mo Koo , Chang Hoon Jung
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Priority: KR10-2006-0026057 20060322
- Main IPC: B05C11/02
- IPC: B05C11/02 ; B05B3/00 ; B05D7/00 ; B05D3/12

Abstract:
A liquid coating apparatus and method for spraying a liquid on a wafer. The liquid coating apparatus may include a nozzle unit spraying the liquid on the wafer and moving relative to the wafer and a laminar flow forming unit forming a forced air flow around the nozzle unit. Though a wake may be formed around the nozzle unit by a movement of the nozzle unit, the laminar forming unit may reduce and/or minimize an influence of the wake.
Information query