Invention Application
- Patent Title: Film forming composition
- Patent Title (中): 成膜组合物
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Application No.: US11723852Application Date: 2007-03-22
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Publication No.: US20070224436A1Publication Date: 2007-09-27
- Inventor: Hidetoshi Hiraoka
- Applicant: Hidetoshi Hiraoka
- Applicant Address: JP Minato-ku
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Minato-ku
- Priority: JP2006-079309 20060322
- Main IPC: B32B27/32
- IPC: B32B27/32
Abstract:
A film forming composition comprises a compound having a cage structure and a thermally decomposable compound, an insulating film is formed by using the film forming composition and an electronic device comprises the insulating film.
Information query
