Invention Application
- Patent Title: Method of processing substrate
- Patent Title (中): 基板处理方法
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Application No.: US11723828Application Date: 2007-03-22
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Publication No.: US20070224547A1Publication Date: 2007-09-27
- Inventor: Shusaku Kido
- Applicant: Shusaku Kido
- Applicant Address: JP KAWASAKI-SHI
- Assignee: NEC LCD TECHNOLOGIES, LTD.
- Current Assignee: NEC LCD TECHNOLOGIES, LTD.
- Current Assignee Address: JP KAWASAKI-SHI
- Priority: JP2006-081467 20060323
- Main IPC: G03F7/26
- IPC: G03F7/26
Abstract:
A method of processing an organic film pattern formed on a substrate, includes, in sequence of, a fusion/deformation step of fusing and thereby deforming the organic film pattern, and a third removal step of removing at least a part of the fused and deformed organic film pattern.
Information query
IPC分类:
