A printed-circuit-board testing device that tests an electronic component disposed on a printed circuit board includes printed-circuit-board-tilt measuring means for measuring tilting of the printed circuit board, measuring means for measuring tilting of an arm having a probe that comes into contact with and tests the electronic component, correcting means for correcting the tilting of the arm on the basis of the tilting of the printed circuit board and the tilting of the arm, inputting means for inputting positional information of the electronic component, arm disposing means for disposing the arm to a predetermined position in accordance with the positional information, and printed-circuit-board testing means for performing testing as a result of protruding the probe from the disposed arm.