Invention Application
- Patent Title: Silicone-Modified Epoxy Resins
- Patent Title (中): 有机硅改性环氧树脂
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Application No.: US11579732Application Date: 2004-06-08
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Publication No.: US20070225407A1Publication Date: 2007-09-27
- Inventor: Akira Okazaki
- Applicant: Akira Okazaki
- International Application: PCT/JP04/08299 WO 20040608
- Main IPC: C08G77/14
- IPC: C08G77/14
![Silicone-Modified Epoxy Resins](/abs-image/US/2007/09/27/US20070225407A1/abs.jpg.150x150.jpg)
Abstract:
Disclosed is a silicone-modified epoxy resin (D) including a structural unit represented by following Formula (4). The epoxy resin (D) is a product of the epoxidation of a vinyl group of a vinyl-containing polyether compound (C) with an oxidizing agent, the vinyl-containing polyether compound (C) has a structural unit represented by following Formula (3) and is a product of the reaction between an epoxy group of 4-vinylcyclohexene-1-oxide (A) represented by following Formula (1) and a silanol group of a silanol-containing organopolysiloxane (B) represented by following Average Compositional Formula (2). The silicone-modified epoxy resin is a polyfunctional cycloaliphatic epoxy resin having an oxycyclohexane skeleton and being improved in thermal stability and hygroscopicity absorptivity. In Formula (2), “a” is 0.01 to 1.99; “b” is 1.99 to 0.01; and R is a residue of monovalent organic compound having one to nine carbon atoms, and the vinyl group in Formula (3) and the epoxy group in Formula (4) are bound at the alpha-position or the beta-position in Formulae (3) and (4), respectively.
Information query