发明申请
- 专利标题: Laser beam processing machine
- 专利标题(中): 激光束加工机
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申请号: US11783190申请日: 2007-04-06
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公开(公告)号: US20070235430A1公开(公告)日: 2007-10-11
- 发明人: Ryugo Oba , Hiroshi Morikazu
- 申请人: Ryugo Oba , Hiroshi Morikazu
- 专利权人: Disco Corporation
- 当前专利权人: Disco Corporation
- 优先权: JP2006-107802 20060410
- 主分类号: B23K26/03
- IPC分类号: B23K26/03 ; B23K26/06
摘要:
A laser beam processing machine comprising a laser beam application means for applying a laser beam to a workpiece held on a chuck table, a processing-feed means, an indexing-feed means, a processing-feed amount detection means for detecting the amount of feed, an indexing-feed amount detection means, and a control means, wherein the condenser constituting the laser beam application means comprises an elliptic spot forming means for forming a focal spot into an elliptic shape and a focal spot turning means for turning the elliptic focal spot on an optical axis as the center thereof; and the control means comprises a storage means for storing the X, Y coordinate values of a processing line formed on the workpiece, obtains the X, Y coordinate values of the current position of a laser beam application position based on detection signals from the processing-feed amount detection means and the indexing-feed amount detection means, and controls the focal spot turning means to ensure that the long axis of the focal spot should follow along the processing line based on the X, Y coordinate values of the detected current position and the X, Y coordinate values of the processing line stored in the storage means.
公开/授权文献
- US08610030B2 Laser beam processing machine 公开/授权日:2013-12-17
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