发明申请
- 专利标题： RFID package structure
- 专利标题（中）： RFID封装结构
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申请号： US11783760申请日： 2007-04-12
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公开(公告)号： US20070241439A1公开(公告)日： 2007-10-18
- 发明人: Yu-Peng Chung , Kuo-Tung Chang , En-Ming Chen , Chia-Wei Li
- 申请人： Yu-Peng Chung , Kuo-Tung Chang , En-Ming Chen , Chia-Wei Li
- 优先权： TW95113475 20060414
- 主分类号： H01L23/02
- IPC分类号： H01L23/02 ; G08B13/14
摘要：
The present invention provides a radio frequency identification (RFID) package structure for improving a low data reading rate of the conventional RFID transponder structure to overcome the disadvantage of the prior art, and packages a RFID die by an adhesive according to a package technology. The RFID package structure provides different ways of improving the data reading capability, such as adding a capacitor. The capacitance of the capacity can be adjusted to provide a RFID package structure applicable for different frequencies, or the RFID package structure formed by the structure of a single substrate together with the use of an adhesive can be used for producing the RFID package structure to lower the manufacturing cost.
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