发明申请
- 专利标题： Apparatus for Effecting Reliable Heat Transfer of Bare Die Microelectroinc Device and Method Thereof
- 专利标题（中）： 用于实现裸模微电极器件可靠传热的装置及其方法
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申请号： US11766997申请日： 2007-06-22
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公开(公告)号： US20070241449A1公开(公告)日： 2007-10-18
- 发明人: John Colbert , Justin Rogers , Arvind Sinha
- 申请人： John Colbert , Justin Rogers , Arvind Sinha
- 申请人地址： US NY Armonk 10504
- 专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人地址： US NY Armonk 10504
- 主分类号： H01L23/34
- IPC分类号： H01L23/34 ; H01L21/00
摘要：
Apparatus and method include using a bare die microelectronic device; a heat sink assembly; a heat sink mounting assembly for mounting the heat sink assembly independently of the bare die microelectronic device; and, a force applying mechanism that compression loads, under controlled forces, a surface of the bare die into a direct heat transfer relationship at a thermal interface with a heat sink assembly.
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