发明申请
- 专利标题: Flip-Chip Mounting Method and Bump Formation Method
- 专利标题(中): 倒装芯片安装方法和凸块形成方法
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申请号: US11579299申请日: 2006-03-07
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公开(公告)号: US20070243664A1公开(公告)日: 2007-10-18
- 发明人: Koichi Hirano , Seiji Karashima , Takashi Ichiryu , Yoshihiro Tomita , Seiichi Nakatani
- 申请人: Koichi Hirano , Seiji Karashima , Takashi Ichiryu , Yoshihiro Tomita , Seiichi Nakatani
- 优先权: JP2005-072526 20050315
- 国际申请: PCT/JP06/04351 WO 20060307
- 主分类号: H05K3/34
- IPC分类号: H05K3/34 ; H01L21/00 ; H01L21/44 ; H05K3/00
摘要:
[Problem] To provide a flip-chip mounting method and a bump formation method applicable to flip-chip mounting of a next generation LSI and having high productivity and high reliability. [Means for Solving Problem] A semiconductor chip 20 having a plurality of electrode terminals 12 is held to oppose a circuit board 21 having a plurality of connection terminals 11 with a given gap provided therebetween, and the semiconductor chip 20 and the circuit board 21 in this state are dipped in a dipping bath 40 containing a melted resin 14 including melted solder particles for a given period of time. In this dipping process, the melted solder particles self-assemble between the connection terminals 11 of the circuit board 21 and the electrode terminals 12 of the semiconductor chip 20, so as to form connectors 22 between these terminals. Thereafter, the semiconductor chip 20 and the circuit board 21 are taken out of the dipping bath 40, and the melted resin 14 having permeated into the gap between the semiconductor chip 20 and the circuit board 21 is cured, so as to complete a flip-chip mounting body.
公开/授权文献
- US07927997B2 Flip-chip mounting method and bump formation method 公开/授权日:2011-04-19