[PROBLEMS]To provide a multilayer wiring board wherein high density wiring exceeding the application limit of the conventional build up wiring boards is made possible. [MEANS FOR SOLVING PROBLEMS]A wiring board is provided with a board, which is formed by stacking along a board flat plane direction of a plurality of dielectric layers arranged along a facing direction of the both main surfaces of the board, and an inner conductor pattern arranged on the surface of the dielectric layer. The adjacent dielectric layers are formed so as to interconnect by being continuously and integrally coupled with each other through being connected at the layer edges on one of the board main planes. The connecting portions of the adjacent dielectric layers are alternately provided on one of the board main planes, and the dielectric layers are formed in a shape of one dielectric sheet that is arranged by being bent.