发明申请
- 专利标题： PACKAGING STRUCTURE FOR ELECTRONIC DEVICE
- 专利标题（中）： 电子设备包装结构
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申请号： US11736552申请日： 2007-04-17
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公开(公告)号： US20070246476A1公开(公告)日： 2007-10-25
- 发明人: Wei Shin She , Chih Yu Liu
- 申请人： Wei Shin She , Chih Yu Liu
- 申请人地址： TW TAOYUAN
- 专利权人： BENQ CORPORATION
- 当前专利权人： BENQ CORPORATION
- 当前专利权人地址： TW TAOYUAN
- 优先权： TWTW95114522 20060424
- 主分类号： B65D25/00
- IPC分类号： B65D25/00
摘要：
A packaging structure for an electronic device. The packaging structure comprises a main body and an auxiliary element. The main body comprises a first side, a second side opposite to the first side, a third side and a bottom adjacent to the third side. The auxiliary element is disposed on the main body. The main body moves along the surface with the auxiliary element contacting the surface.
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