发明申请
- 专利标题： Semiconductor module featuring solder balls having lower melting point than that of solder electrode terminals of electronic device containing additional metal powder component
- 专利标题（中）： 半导体模块具有焊料熔点低于包含附加金属粉末成分的电子器件的焊料电极端子的熔点
-
申请号： US11790081申请日： 2007-04-23
-
公开(公告)号： US20070246818A1公开(公告)日： 2007-10-25
- 发明人: Daisuke Ejima , Tsuyoshi Kida , Hiroshi Yamashita
- 申请人： Daisuke Ejima , Tsuyoshi Kida , Hiroshi Yamashita
- 申请人地址： JP Kawasaki
- 专利权人： NED ELECTRONICS CORPORATION
- 当前专利权人： NED ELECTRONICS CORPORATION
- 当前专利权人地址： JP Kawasaki
- 优先权： JP2006-118741 20060424
- 主分类号： H01L23/48
- IPC分类号： H01L23/48
摘要：
A semiconductor module includes a wiring board having a bottom surface and a top surface. A first solder electrode terminal has a given melting point, and is provided on the bottom surface of the wiring board. An electrode pad is provided on or above the top surface of the wiring board, and a second solder electrode terminal is soldered to the electrode pad at a temperature corresponding to the given melting point of the first solder electrode terminal by using a reflow process. The second solder electrode terminal contains an additional metal powder component diffused therein when being soldered to the electrode pad.