A temperature-compensated crystal oscillator for surface mounting wherein an IC chip into which is integrated a temperature-compensated device having an oscillating circuit and a temperature sensor, which supplies a compensation voltage to a variable-voltage capacitor element of the oscillating circuit, and which also has IC terminals disposed along two edges comprising at least diagonally opposite corner portions of one main surface that acts as a circuit function surface is affixed with the use of bumps to an inner base surface of a main container that is concave in section, and one edge portion of a crystal piece is affixed to an inner wall step portion of the main container; wherein an active element of the oscillating circuit that acts as a heat source and a temperature sensor of the temperature-compensated device are disposed at diagonally opposite corner regions of the IC chip at the greatest distance apart. In addition, IC terminals for thermal dissipation are provided in a central region of the IC chip. The present invention provides a temperature-compensated oscillator for surface mounting in which the temperature-compensation operation at startup is satisfactory and frequency stability is maintained.