A method of manufacturing an electrode pattern comprises preparing a first support film; forming a mold release pattern on one surface of the first support film, the mold release pattern defining an internal electrode formation region; forming an electrode layer on the mold release pattern by using a thin film technique; preparing a second support film; forming a transfer target layer on one surface of the second support film; disposing the electrode layer of the first support film and the transfer target layer of the second support film such that the electrode layer and the transfer target layer face each other; thermally compression-bonding the first and second films disposed to face each other such that the electrode layer positioned on the mold release pattern is transferred onto the transfer target layer; and separating the first and second films from each other.