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发明申请
US20070252242A1 Semiconductor device 审中-公开
半导体器件

Semiconductor device
摘要：
An uppermost one of multilayered electrode pads, on which a bump and a plating coat will be formed, is made of metal having high ionization tendency, particularly, Al. On the other hand, an uppermost one of multilayered electrode pads, on which none of the bump and the plating coat will be formed, is made of metal having low ionization tendency, particularly, Cu.
摘要（中）：

其上形成有凸起和镀覆层的多层电极焊盘中最上方的电极由具有高电离倾向的金属，特别是Al制成。 另一方面，不会形成凸起和镀覆层的多层电极焊盘的最上面的一个由离子化倾向低的金属，特别是Cu构成。

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