Molded SiP package with reinforced solder columns

Invention Application

US20070252254A1 Molded SiP package with reinforced solder columns 有权

Title translation: 带增强焊料柱的成型SiP封装

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Patent Title: Molded SiP package with reinforced solder columns
Patent Title (中): 带增强焊料柱的成型SiP封装
Application No.: US11414526

Application Date: 2006-04-28
Publication No.: US20070252254A1

Publication Date: 2007-11-01
Inventor: Chin-Tien Chiu , Hem Takiar , Hui Liu , Jiang hua Java Zhu , Jack Chang-Chien , Cheemen Yu
Applicant: Chin-Tien Chiu , Hem Takiar , Hui Liu , Jiang hua Java Zhu , Jack Chang-Chien , Cheemen Yu
Main IPC: H01L23/02
IPC: H01L23/02

Molded SiP package with reinforced solder columns

Abstract:

An integrated circuit, and a semiconductor die package formed therefrom, are disclosed including solder columns for adding structural support to the package during the fabrication process.

Abstract(Chinese):

公开了集成电路和由其形成的半导体管芯封装，其包括用于在制造工艺期间向封装件添加结构支撑的焊料柱。

Public/Granted literature

US08878346B2 Molded SiP package with reinforced solder columns Public/Granted day:2014-11-04

Information query

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IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L23/00	半导体或其他固态器件的零部件（H01L25/00优先）
H01L23/02	.容器；封接（H01L23/12，H01L23/34，H01L23/48，H01L23/552优先）