Invention Application
- Patent Title: Split Core Circuit Module
- Patent Title (中): 分离核心电路模块
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Application No.: US11777925Application Date: 2007-07-13
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Publication No.: US20070258217A1Publication Date: 2007-11-08
- Inventor: David Roper , Douglas Wehrly , Mark Wolfe
- Applicant: David Roper , Douglas Wehrly , Mark Wolfe
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
Flexible circuitry is populated with integrated circuitry (ICs) disposed along one or both major sides. Contacts distributed along the flexible circuitry provide connection between the module and an application environment. A rigid substrate configured with wings diverging from a central axis to create, preferably, a ‘V’-shaped structure provide supportive structure for the populated flex circuitry that is wrapped about an edge of the substrate.
Public/Granted literature
- US07522421B2 Split core circuit module Public/Granted day:2009-04-21
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