发明申请
- 专利标题： CIRCUIT BOARD, METHOD FOR MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE
- 专利标题（中）： 电路板，其制造方法和半导体器件
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申请号： US11748111申请日： 2007-05-14
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公开(公告)号： US20070262447A1公开(公告)日： 2007-11-15
- 发明人: Koichi HIRANO , Tsukasa SHIRAISHI , Seiichi NAKATANI , Tatsuo OGAWA
- 申请人： Koichi HIRANO , Tsukasa SHIRAISHI , Seiichi NAKATANI , Tatsuo OGAWA
- 申请人地址： JP Osaka 571-8501
- 专利权人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- 当前专利权人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- 当前专利权人地址： JP Osaka 571-8501
- 优先权： JP2006-135576 20060515
- 主分类号： H01L23/48
- IPC分类号： H01L23/48
摘要：
A circuit board 1 having a base material 10 and an electrode 11 formed on at least one main surface of the base material 10 includes an easy peeling portion 12 formed in at least one of an inner portion and a side portion of the electrode 11, with the adhesive strength between the electrode 11 and the easy peeling portion 12 being less than the adhesive strength between the electrode 11 and the base material 10. A circuit board that has high connection reliability and enables narrow pitch mounting thereby can be provided.
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