发明申请
- 专利标题: Multi-Chip Package for a Flash Memory
- 专利标题(中): 闪存的多芯片封装
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申请号: US11694779申请日: 2007-03-30
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公开(公告)号: US20070263440A1公开(公告)日: 2007-11-15
- 发明人: Michael J. Cornwell , Christopher P. Dudte
- 申请人: Michael J. Cornwell , Christopher P. Dudte
- 申请人地址: US CA Cupertino
- 专利权人: APPLE INC.
- 当前专利权人: APPLE INC.
- 当前专利权人地址: US CA Cupertino
- 主分类号: G11C16/04
- IPC分类号: G11C16/04
摘要:
An electronic system includes a flash memory die having multiple flash memory cells. Each flash memory cell is operable to store at least four bits of data. A second die includes a controller for accessing the flash memory cells. DRAM is used by the controller to temporarily store data. An interface is operable to send and receive signals associated with the flash memory cells to a host. A housing contains the flash memory die, the second die, the DRAM, and the interface.
公开/授权文献
- US07852690B2 Multi-chip package for a flash memory 公开/授权日:2010-12-14
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