发明申请
US20070267731A1 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH DIFFERENT MOLD LOCKING FEATURES
有权
具有不同模具锁定功能的集成电路封装系统
- 专利标题： INTEGRATED CIRCUIT PACKAGE SYSTEM WITH DIFFERENT MOLD LOCKING FEATURES
- 专利标题（中）： 具有不同模具锁定功能的集成电路封装系统
-
申请号： US11749693申请日： 2007-05-16
-
公开(公告)号： US20070267731A1公开(公告)日： 2007-11-22
- 发明人: Jeffrey D. Punzalan , Henry Descalzo Bathan , Zigmund Ramirez Camacho
- 申请人： Jeffrey D. Punzalan , Henry Descalzo Bathan , Zigmund Ramirez Camacho
- 主分类号： H01L29/00
- IPC分类号： H01L29/00 ; H01L23/02 ; H01L21/00
摘要：
An integrated circuit package system is provided including forming a first inner lead having a first inner bottom side and a first outer lead, forming a first side lock of the first inner lead above the first inner bottom side, connecting an integrated circuit die with the first inner lead and the first outer lead, and encapsulating the integrated circuit die and the first side lock.
公开/授权文献
信息查询
IPC分类:
