发明申请
US20070267751A1 Structure and method for creating reliable via contacts for interconnect applications
有权
用于为互连应用创建可靠的通孔触点的结构和方法
- 专利标题: Structure and method for creating reliable via contacts for interconnect applications
- 专利标题(中): 用于为互连应用创建可靠的通孔触点的结构和方法
-
申请号: US11435410申请日: 2006-05-17
-
公开(公告)号: US20070267751A1公开(公告)日: 2007-11-22
- 发明人: Ghih-Chao Yang , Oscar Van Der Straten
- 申请人: Ghih-Chao Yang , Oscar Van Der Straten
- 申请人地址: US NY Armonk
- 专利权人: International Business Machines Corporation
- 当前专利权人: International Business Machines Corporation
- 当前专利权人地址: US NY Armonk
- 主分类号: H01L23/52
- IPC分类号: H01L23/52
摘要:
A reliable and mechanical strong interconnect structure is provided that does not include gouging features in the bottom of the an opening, particularly at a via bottom. Instead, the interconnect structures of the present invention utilize a Co-containing buffer layer that is selectively deposited on exposed surfaces of the conductive features that are located in a lower interconnect level. The selective deposition is performed through at least one opening that is present in a dielectric material of an upper interconnect level. The selective deposition is performed by electroplating or electroless plating. The Co-containing buffer layer comprises Co and at least one of P and B. W may optionally be also present in the Co-containing buffer layer.
公开/授权文献
- US07800228B2 Reliable via contact interconnect structure 公开/授权日:2010-09-21