发明申请
- 专利标题： MODULAR GRAFT COMPONENT JUNCTIONS
- 专利标题（中）： 模块化分量组合
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申请号： US11750198申请日： 2007-05-17
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公开(公告)号： US20070276462A1公开(公告)日： 2007-11-29
- 发明人: Octavian Iancea , Timothy Chuter , Arnold Escano , Reid Hayashi , Robin Eckert , Matthew Fitz , Shahrokh Farahani , Juan Perez , Richard Newhauser , David Pollock , Aleta Tesar
- 申请人： Octavian Iancea , Timothy Chuter , Arnold Escano , Reid Hayashi , Robin Eckert , Matthew Fitz , Shahrokh Farahani , Juan Perez , Richard Newhauser , David Pollock , Aleta Tesar
- 申请人地址： US CA Santa Clara 95054
- 专利权人： ENDOVASCULAR TECHNOLOGIES, INC.
- 当前专利权人： ENDOVASCULAR TECHNOLOGIES, INC.
- 当前专利权人地址： US CA Santa Clara 95054
- 主分类号： A61F2/06
- IPC分类号： A61F2/06
摘要：
The present invention embodies an endovascular graft having an attachment frame connection mechanism that allows placement of the main body component in vasculature in combination with limb components. Various limb component-to-main body component attachment mechanisms are provided which ensure a reliable bond while facilitating a smaller delivery profile.
公开/授权文献
- US08337547B2 Modular graft component junctions 公开/授权日：2012-12-25
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