发明申请
- 专利标题： SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
- 专利标题（中）： 基板加工方法和基板加工装置
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申请号： US11758389申请日： 2007-06-05
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公开(公告)号： US20070277856A1公开(公告)日： 2007-12-06
- 发明人: Akio Hashizume
- 申请人： Akio Hashizume
- 优先权： JP2006-156485 20060605
- 主分类号： B08B3/00
- IPC分类号： B08B3/00
摘要：
A substrate processing method according to the present invention is to be applied for stripping and removing, from the surface of a substrate, a resist no longer required. According to the substrate processing method, a resist stripping liquid is supplied to the center portion of the surface of a substrate held by a substrate holding unit. An organic solvent liquid is supplied to the peripheral edge portion of the surface of the substrate held by the substrate holding unit.
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