A heat dissipation module includes a heat column and a plurality of heat dissipation fins disposed outside of the heat column and connected with the heat column. The heat column has a column body and a base, and the column body has a top portion and a sidewall ringed with the top portion. The sidewall and the top portion are integrally formed. The base is disposed opposite to the top portion, and the base has an indentation for allowing an end of the sidewall of the column body to insert so as to form a closed space between the base and the column body. The base further has an annular protrusion close to the indentation, and after the end of the sidewall of the column body is inserted into the indentation of the base, the annular protrusion is processed to be filled between the indentation and the sidewall so as to tightly assemble the base and the column body.