发明申请
- 专利标题： Stackable semiconductor package
- 专利标题（中）： 可堆叠半导体封装
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申请号： US11636993申请日： 2006-12-12
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公开(公告)号： US20070278640A1公开(公告)日： 2007-12-06
- 发明人: Gwo-Liang Weng , Yung-Li Lu , Cheng-Yin Lee
- 申请人： Gwo-Liang Weng , Yung-Li Lu , Cheng-Yin Lee
- 优先权： TW095119249 20060530
- 主分类号： H01L23/02
- IPC分类号： H01L23/02
摘要：
The present invention relates to a stackable semiconductor package comprising a first substrate, a semiconductor device, a second substrate, a plurality of first wires, a supporting element, and a first molding compound. The semiconductor device is disposed on the first substrate. The second substrate is disposed above the semiconductor device, and the area of the second substrate is larger than that of the semiconductor device. The first wires electrically connect the first substrate and the second substrate. The supporting element is disposed between the first substrate and the second substrate, and is used to support the second substrate. Some pads of the second substrate are exposed outside the first molding compound. Therefore, the overhang portion of the second substrate will not shake or sway during a wire bonding process, and the area of the second substrate can be increased to receive more devices disposed thereon. In addition, the thickness of the second substrate can be reduced, so as to reduce the overall thickness of the stackable semiconductor package.
公开/授权文献
- US07589408B2 Stackable semiconductor package 公开/授权日：2009-09-15
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