发明申请
- 专利标题： INTEGRATED CIRCUIT PACKAGE SYSTEM WITH EDGE CONNECTION SYSTEM
- 专利标题（中）： 具有边缘连接系统的集成电路封装系统
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申请号： US11421051申请日： 2006-05-30
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公开(公告)号： US20070278660A1公开(公告)日： 2007-12-06
- 发明人: Byung Joon Han , Il Kwon Shim , Seng Guan Chow
- 申请人： Byung Joon Han , Il Kwon Shim , Seng Guan Chow
- 申请人地址： SG Singapore
- 专利权人： STATS ChipPAC LTD.
- 当前专利权人： STATS ChipPAC LTD.
- 当前专利权人地址： SG Singapore
- 主分类号： H01L23/04
- IPC分类号： H01L23/04
摘要：
An integrated circuit package system including a plurality of substrates and a plurality of semiconductor devices formed on each of the substrates. An edge connection system is provided and an electrical edge connector on each of the substrates is for attachment to the edge connection system. A vertically stacked configuration of the substrates is formed by attaching the substrates to the edge connection system.
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