发明申请
US20070279753A1 Patterning of mechanical layer in MEMS to reduce stresses at supports
失效
MEMS中机械层的图案化，以减少支撑件的应力
- 专利标题： Patterning of mechanical layer in MEMS to reduce stresses at supports
- 专利标题（中）： MEMS中机械层的图案化，以减少支撑件的应力
-
申请号： US11445529申请日： 2006-06-01
-
公开(公告)号： US20070279753A1公开(公告)日： 2007-12-06
- 发明人: Ming-Hau Tung , Wonsuk Chung
- 申请人： Ming-Hau Tung , Wonsuk Chung
- 主分类号： G02B27/14
- IPC分类号： G02B27/14
摘要：
A method of fabricating a MEMS device includes the formation of support posts having horizontal wing portions at the edges of the post. A mechanical layer is deposited over the support posts and portions of the mechanical layer overlying portions of the support post other than the horizontal wing portions are etched away. A resultant MEMS device includes a mechanical layer overlying at least a portion of the horizontal wing portions of the underlying support structures.