Invention Application
US20070281097A1 CURABLE SILICONE GEL COMPOSITION FOR APPLICATION AND CURING IN LOCATIONS WHERE SOLDER FLUX EXISTS, AND METHOD OF IMPROVING FLUX RESISTANCE OF SILICONE GEL AND METHOD OF FORMING A FLUX-RESISTANT SILICONE GEL USING THE COMPOSITION
审中-公开
用于在焊剂熔体存在的地方施用和固化的可固化硅胶凝胶组合物，以及改善硅胶耐电流性的方法和使用组合物形成耐磁硅胶的方法
- Patent Title: CURABLE SILICONE GEL COMPOSITION FOR APPLICATION AND CURING IN LOCATIONS WHERE SOLDER FLUX EXISTS, AND METHOD OF IMPROVING FLUX RESISTANCE OF SILICONE GEL AND METHOD OF FORMING A FLUX-RESISTANT SILICONE GEL USING THE COMPOSITION
- Patent Title (中): 用于在焊剂熔体存在的地方施用和固化的可固化硅胶凝胶组合物，以及改善硅胶耐电流性的方法和使用组合物形成耐磁硅胶的方法
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Application No.: US11742910Application Date: 2007-05-01
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Publication No.: US20070281097A1Publication Date: 2007-12-06
- Inventor: Masayuki IKENO , Miyuki Tanaka , Kazuyasu Sato
- Applicant: Masayuki IKENO , Miyuki Tanaka , Kazuyasu Sato
- Applicant Address: JP Chiyoda-ku
- Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee Address: JP Chiyoda-ku
- Priority: JP2006-128537 20060502
- Main IPC: C08G77/12
- IPC: C08G77/12 ; B05D3/02
Abstract:
A curable silicone gel composition that can be applied and cured in locations where solder flux exists, the composition comprising: (A) a diorganovinylsiloxy-terminated organopolysiloxane, (B) a non-functional organopolysiloxane, (C) an organohydrogenpolysiloxane containing an average of 3 or more hydrogen atoms bonded to silicon atoms within each molecule, and (D) a hydrosilylation reaction catalyst. A method of improving the solder flux resistance of a silicone gel, and a method of forming a silicone gel with excellent solder flux resistance, both methods using the above composition.
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