发明申请
- 专利标题: Substrate Dividing System, Substrate Manufacturing Equipment, Substrate Scribing Method and Substrate Dividing Method
- 专利标题(中): 基板分割系统,基板制造设备,基板划线方法和基板划分方法
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申请号: US10598878申请日: 2005-03-14
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公开(公告)号: US20070281444A1公开(公告)日: 2007-12-06
- 发明人: Yoshitaka Nishio , Yasutomo Okajima , Yukio Oshima , Hiroyuki Ohnari , Kazuhiro Yoshimoto
- 申请人: Yoshitaka Nishio , Yasutomo Okajima , Yukio Oshima , Hiroyuki Ohnari , Kazuhiro Yoshimoto
- 申请人地址: JP Osaka
- 专利权人: MITSUBOSHI DIAMOND INDUSTRIAL CO., LTD.
- 当前专利权人: MITSUBOSHI DIAMOND INDUSTRIAL CO., LTD.
- 当前专利权人地址: JP Osaka
- 优先权: JP2004-117374 20040315
- 国际申请: PCT/JP05/04478 WO 20050314
- 主分类号: H01L21/78
- IPC分类号: H01L21/78 ; B26F3/00
摘要:
The objective of the present invention is to provide a substrate cutting system which requires a small footprint area so as to be compact, and also which is capable of efficiently cutting a substrate. Clamp devices 50 are attached to the substrate cutting system. The clamp devices can hold at least one part of a side edge of the mother substrate to be carried-in a mounting base 10 in a hollow rectangular parallelepiped and reciprocate along one side of the mounting base 10 in a hollow rectangular parallelepiped. A pair of substrate cutting devices are provided in a cutting device guide body 30 so as to be movable along a direction perpendicular to the moving direction of the clamp devices 50, the pair of substrate cutting devices cutting the mother substrate from each of the top surface and the bottom surface of the mother substrate which is clamped by the clamp devices 50. When the clamp devices 50 holding the mother substrate are moved, a substrate supporting device supports the mother substrate without rubbing against the mother substrate.