Invention Application
- Patent Title: Curable composition
- Patent Title (中): 可固化组合物
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Application No.: US11806346Application Date: 2007-05-31
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Publication No.: US20070282080A1Publication Date: 2007-12-06
- Inventor: Atsushi Kawakami , Seigo Nakamura
- Applicant: Atsushi Kawakami , Seigo Nakamura
- Applicant Address: JP Osaka-shi US TX Pasadena
- Assignee: Kaneka Corporation,Kaneka Texas Corporation
- Current Assignee: Kaneka Corporation,Kaneka Texas Corporation
- Current Assignee Address: JP Osaka-shi US TX Pasadena
- Main IPC: C08L75/08
- IPC: C08L75/08 ; C08L71/02
Abstract:
An object of the invention is to provide a curable composition wherein the adhesiveness to thermoplastic polyolefin (TPO) is improved. The invention is a curable composition containing (A) a polyoxyalkylene polymer having reactive silicon group(s), (B) a polyolefin polymer, and (C) a tackifying resin.
Public/Granted literature
- US07759425B2 Curable composition Public/Granted day:2010-07-20
Information query
