发明申请
- 专利标题： Method For Silver Plating
- 专利标题（中）： 镀银方法
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申请号： US11759417申请日： 2007-06-07
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公开(公告)号： US20070284258A1公开(公告)日： 2007-12-13
- 发明人: Masakazu Yoshimoto , Shingo Kitamura , Seiji Omori , Toshifumi Kadokawa
- 申请人： Masakazu Yoshimoto , Shingo Kitamura , Seiji Omori , Toshifumi Kadokawa
- 优先权： JP2006-161049 20060609
- 主分类号： C25D3/46
- IPC分类号： C25D3/46
摘要：
The invention provides a method for silver plating using a non-cyanide acid silver plating bath to form a silver plating film exhibiting good adhesiveness while suppressing dissolution of resist in pattern plating. The method includes conducting strike plating using a non-cyanide acid strike plating bath prior to the silver plating.
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