A thermal module with heat pipe is disclosed to include a heat-dissipation plate, which has an accommodation groove that accommodates a heat pipe that is bonded to the accommodation groove with a bonding glue, and at least one retaining groove formed in the accommodation groove for retaining the bonding glue to prevent overflow of the bonding glue during its fluid state so as to improve the yield rate of the fabrication of the thermal module with heat pipe, avoid a further follow-up process, facilitate the quality control, save the cost, and keep a good looking of the finished product.