Invention Application
- Patent Title: Heat dissipation module
- Patent Title (中): 散热模块
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Application No.: US11783228Application Date: 2007-04-06
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Publication No.: US20070286720A1Publication Date: 2007-12-13
- Inventor: Shun-Chen Chang , Chia-Ming Hsu , Tsung-Yu Lei , Chin-Sheng Liu , Peng-Chu Tao , Chia-Ching Lin , Shih-Wei Huang , Ching-Chuang Mai , Wen-Shi Huang , Hsiou-Chen Chang
- Applicant: Shun-Chen Chang , Chia-Ming Hsu , Tsung-Yu Lei , Chin-Sheng Liu , Peng-Chu Tao , Chia-Ching Lin , Shih-Wei Huang , Ching-Chuang Mai , Wen-Shi Huang , Hsiou-Chen Chang
- Assignee: DELTA ELECTRONICS INC.
- Current Assignee: DELTA ELECTRONICS INC.
- Priority: TW95120366 20060608; TW95124604 20060706
- Main IPC: F01D1/02
- IPC: F01D1/02

Abstract:
A heat dissipation module includes a housing, and a fan including an outer frame, a first rotor, a base, a second rotor and a driving device. The first rotor includes a shaft, a first hub and a plurality of first rotor blades disposed around the first hub. The base is disposed in the outer frame. The second rotor includes a plurality of second rotor blades, and is coupled to the shaft of the first rotor and disposed next to the first rotor. The driving device is supported by the base for driving the first rotor and the second rotor simultaneously.
Public/Granted literature
- US07874796B2 Heat dissipation module Public/Granted day:2011-01-25
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