发明申请
US20070287763A1 MOLD RELEASE COMPOUNDS USING CYCLOALIPHATIC EPOXIDE FUNCTIONALIZED POLYDIMETHYLSILOXANE COATINGS AND PHOTO-INITIATED POLYMERIZATION
有权
使用环氧环氧化物官能化聚二甲基硅氧烷涂料和光引发聚合的模具释放化合物
- 专利标题： MOLD RELEASE COMPOUNDS USING CYCLOALIPHATIC EPOXIDE FUNCTIONALIZED POLYDIMETHYLSILOXANE COATINGS AND PHOTO-INITIATED POLYMERIZATION
- 专利标题（中）： 使用环氧环氧化物官能化聚二甲基硅氧烷涂料和光引发聚合的模具释放化合物
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申请号： US11753904申请日： 2007-05-25
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公开(公告)号： US20070287763A1公开(公告)日： 2007-12-13
- 发明人: Mark Soucek , David Dworak
- 申请人： Mark Soucek , David Dworak
- 主分类号： C08F2/50
- IPC分类号： C08F2/50
摘要：
The present invention is generally related to mold release compounds having improved cure times, environmental friendliness and durability that are formed from cycloaliphatic epoxide functionalized polydimethylsiloxane compounds In still another embodiment, the present invention relates to mold release compounds that are formed from cycloaliphatic epoxide functionalized poly(dimethylsiloxane-co-methylhydrosiloxane) compounds.
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