发明申请
- 专利标题： Methods for Manufacturing a Sensor Assembly
- 专利标题（中）： 制造传感器组件的方法
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申请号： US11791749申请日： 2005-11-29
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公开(公告)号： US20070292983A1公开(公告)日： 2007-12-20
- 发明人: Moshe Kriman , Merav Yaakoby
- 申请人： Moshe Kriman , Merav Yaakoby
- 申请人地址： IL Kfar-Saba 44643
- 专利权人： N-trig Ltd.
- 当前专利权人： N-trig Ltd.
- 当前专利权人地址： IL Kfar-Saba 44643
- 国际申请： PCT/IL05/01271 WO 20051129
- 主分类号： H01L31/18
- IPC分类号： H01L31/18 ; H01L21/60
摘要：
A method for connecting substrates having electrical conductive elements thereon, comprising: providing at least one spacer between the substrates; applying a conductive material to at least one of the electrical conductive elements; aligning the electrical conductive elements; and, connecting the substrates by urging them together, wherein the at least one spacer prevents lateral spreading of the conductive material on the substrates from bridging a distance between adjacent conductive elements during the connecting.
公开/授权文献
- US07906364B2 Methods for manufacturing a sensor assembly 公开/授权日：2011-03-15
信息查询
IPC分类:
